3D packaging implies the use of 3D schemes based on conventional methods, such as wire bonding for vertical stacks and flip-chip interconnection. PoP configurations that are connected to stacked memory dies are also included in the global 3D semiconductor packaging market. Flip-chips are largely related to the 3D SiPs which have a great deal of applications in mainstream manufacturing and in infrastructure that are already established.
The research report provides a detailed examinations of the global 3D semiconductor packaging market, including data on the market history. The report thus provides a qualitative analysis of the market based on its historical and current data, as well as market drivers, restraints, and trends, in order to gauge the likelihood of success for players over the coming years. The report also presents factors such as threats from substitute products and new entrants through a descriptive Porter’s Five Forces analysis, while enumerating the leading profiles of the market in a SWOT analysis. The key segmentations of the global 3D semiconductor packaging market, as elaborated on in the report, are based on market regions, types of products, types of technologies in use, and the top applications of 3D semiconductor packaging.
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Of the key factors driving the global 3D semiconductor packaging market, a common one for all regions is the increasing use of portable electronics. The demand for miniaturized circuits is increased at a tremendous rate across the globe, and thanks to technological advancements and technical support, the use of 3D semiconductor packaging is finding favor with manufacturers from several end-use industries. Another key trend to look out for is the boom in all technologies related to the Internet of Things concept.
Based on applications, the global 3D semiconductor packaging market is dominated by the high demand shown for 3D wire bonding. The tremendous spur in the use of flash memory devices is creating a high demand for 3D wire bonding in electronics, primarily due to its already widespread usage and high market penetration. Flash memory is also being used on a large scale in robotics and consumer electronics, further fuelling the demand for 3D wire bonding.
From a geographical perspective, the global 3D semiconductor packaging market can be divided along the key market regions of the world: North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa. The overall demand for 3D semiconductor packaging has been exceptionally high in Asia Pacific and this region is expected to lead the market in terms of growth rate over the report’s forecast period.
North America and Europe are expected to continue their steady increase in demand for 3D semiconductor packaging as the market in both regions is considered mature. A great deal of manufacturers in the global 3D semiconductor packaging market hold capacities in Asia Pacific, allowing it to be the leading region in the market currently.
The leading entities in the global 3D semiconductor packaging market so far, have included Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. LTD., International Business Machine Corporation (IBM), Qualcomm Technology Inc., Intel Corporation, Taiwan Semiconductor Manufacturing Company Ltd., Stmicroelectronics N.V., Siliconware Precision Industries Co., Ltd (SPIL), Suss Microtec AG., and ASE Group.